研發工程師 Package designer (覆晶封裝)

工作内容

Job Description

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip)

Requirement

1. Master’s or above degree with a major in Engineering.

2. Over 2 years professional experience in IC Assembly R&D role.

3. Strong technical problem-solving and interpersonal skills.

4. Fluent in both oral and written English communication.

* 薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。

* 資深人員薪資另議。

* 勞工一般體格檢查：為符合職業安全衛生法規定，報到前請完成體檢，並於報到當日繳交體檢報告，以配合法令保護您的權益。