研發工程師 Package designer (覆晶封裝)

☞ PTI 力成科技

Aussicht: 263

Update Tag: 05-11-2024

Ort: Hsinchu County

Kategorie: Design - Web R & D Planung / Projekte

Industrie: Semiconductor Manufacturing

Position: Associate

Jobtyp: Full-time

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Jobinhalt

Job Description

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip)

  • Package RFQ and structure & BOM selection.
  • Direct material evaluation and survey.
  • FA and Reverse Engineering.
  • Package design rule maintain & update.
  • Advance products design / NPI projects development.
  • Research & setup package roadmap / material roadmap.

    • Requirement

    1. Master’s or above degree with a major in Engineering.

    2. Over 2 years professional experience in IC Assembly R&D role.

    3. Strong technical problem-solving and interpersonal skills.

    4. Fluent in both oral and written English communication.

    * 薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。

    * 資深人員薪資另議。

    * 勞工一般體格檢查：為符合職業安全衛生法規定，報到前請完成體檢，並於報到當日繳交體檢報告，以配合法令保護您的權益。

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    Frist: 20-12-2024

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