Packaging Development Engineer (Power Module)
View: 154
Update day: 05-11-2024
Location: Zhongshan District Taipei City
Category: High Technology Mechanical / Technical Electrical / Electronics
Industry: Semiconductor Manufacturing Industrial Machinery Manufacturing
Position: Mid-Senior level
Job type: Full-time
Job content
Job Description
- Packaging Development Engineer for power electronic products
- Package design and process development in co-operation with supplier and product engineering team.
- Developing solutions for assembly processes for automotive application.
- Coordination of sample manufacturing at assembly partner.
- Team work in English language with a multitude of international interfaces is mandatory.
Qualifications
- 3-8 years experiences in packaging/assembly of semiconductors including power semiconductors preferred
- Solid technical background in assembly technology
- Passion for developing technical solutions in multidisciplinary international projects
- Very good English skills and experience in international cooperation
- Ability to travel
Please apply via below link:
https://smrtr.io/bf2ZJ
Deadline: 20-12-2024
Click to apply for free candidate
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