Packaging Development Engineer (Power Module)
Vue: 153
Jour de mise à jour: 05-11-2024
Localisation: Zhongshan District Taipei City
Catégorie: Haute technologie Mécanique / Technique Electrique / Electronique
Industrie: Semiconductor Manufacturing Industrial Machinery Manufacturing
Niveau: Mid-Senior level
Type d’emploi: Full-time
le contenu du travail
Job Description
- Packaging Development Engineer for power electronic products
- Package design and process development in co-operation with supplier and product engineering team.
- Developing solutions for assembly processes for automotive application.
- Coordination of sample manufacturing at assembly partner.
- Team work in English language with a multitude of international interfaces is mandatory.
Qualifications
- 3-8 years experiences in packaging/assembly of semiconductors including power semiconductors preferred
- Solid technical background in assembly technology
- Passion for developing technical solutions in multidisciplinary international projects
- Very good English skills and experience in international cooperation
- Ability to travel
Please apply via below link:
https://smrtr.io/bf2ZJ
Date limite: 20-12-2024
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