Packaging Development Engineer (Power Module)

작업 내용

Job Description

- Packaging Development Engineer for power electronic products

- Package design and process development in co-operation with supplier and product engineering team.

- Developing solutions for assembly processes for automotive application.

- Coordination of sample manufacturing at assembly partner.

- Team work in English language with a multitude of international interfaces is mandatory.

Qualifications

- 3-8 years experiences in packaging/assembly of semiconductors including power semiconductors preferred

- Solid technical background in assembly technology

- Passion for developing technical solutions in multidisciplinary international projects

- Very good English skills and experience in international cooperation

- Ability to travel

Please apply via below link:

https://smrtr.io/bf2ZJ