技術工程類-產品工程師(記憶體封裝)

☞ PTI 力成科技

View: 121

Update day: 05-11-2024

Location: Hsinchu County

Category: High Technology Mechanical / Technical Electrical / Electronics Production / Operation

Industry: Semiconductor Manufacturing

Position: Associate

Job type: Full-time

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Job content

工作內容

  • 職務說明 ：
    • Package design
      a. Package RFQ for cost estimation
      b. New device package feasibility & technical risk assessment
      c. Package structure, BOM design
      d. Package design rule setup & update
      e. Coordinate DR0 design review meeting
      f. PKG structure confirmation after setup
    • Package research & development
      • a. Research & setup package roadmap / material roadmap
      b. New package development
      c. New material survey & capability development
      d. Setup direct material purchase specification
      e. Technical benchmark with competitors (Reverse engineering)

  • 工作待遇 ： NTD$30,000~NTD$50,000；資深人員薪資另議。
    *實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。
  • 上班地點 ： 新竹工業區
  • 管理責任 ： 無需負擔管理責任
  • 出差外派 ： 無須出差
  • 上班時段 ： 0830-1730
  • 休假制度 ： 週休二日

    • 工作條件

  • 工作經驗 ： 1 年以上半導體封測或製造相關經驗
  • 科系要求 ： 理工相關科系
  • 語文條件 ： 流利的商業英語會話能力佳

    • Job Description

    • Customer Engineering Accoumt Management
      a.Meet and exceed customer’s expectation of advanced package engineering in terms of quality, cost and delivery.
      b.Offer industrial leader’s advanced package solutions and services through integration of package and process development.
    • Project Management
      a. Project phase in schedule arrangement and follow up.
      b. SWR arrangement, schedule follow up, negotiation, etc.
      c. Reliability arrangement.
    • Team Work
      a. Optimize resource allocation.
      b. Enhance teamwork in 360° including customer, supplier and our colleagues.
      c. Develop self and others’ production.

  • Salary: NTD$30,000~NTD$50,000; Senior staff salary is negotiable.
  • Location:Hsinchu Industrial Park
  • Office Hours:0830-1730
  • Leave: The two-day weekend.

    • Requirements

    • 1 years or above of experience in the field of OSAT or foundry.
    • Graduated from the Science and Engineering.
    • Proficiency in Business English.
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    Deadline: 20-12-2024

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