Packaging Development Engineer (IC products)

工作内容

Job Description

- Packaging Development Engineer for IC products

- Package design and process development in co-operation with supplier and product engineering team for integrated circuits.

- Developing solutions for assembly processes for automotive application.

- Coordination of sample manufacturing at assembly partner.

- Team work in English language with a multitude of international interfaces is mandatory.

Qualifications

- 3-8 years experience in packaging/assembly of semiconductors. Focus on wire bonding, flip chip, and SiP preferred.

- Solid technical background in assembly technology

- Passion for developing technical solutions in multidisciplinary international projects

- Very good English skills - written and spoken

- Experience in international cooperation

- Ability to travel

Please apply via below link:

https://smrtr.io/b6C6P