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工作类型: Full-time
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工作内容
Google welcomes people with disabilities.Note: By applying to this position you will have an opportunity to share your preferred working location for this position from the following: Taoyuan, Taoyuan District, Taoyuan City, Taiwan; Xindian District, New Taipei City, Taiwan
Minimum qualifications:
- Bachelor’s degree in Electronics or equivalent practical experience
- 3 years of Computer-aided Design (CAD) or Printed Circuit Board (PCB) design experience
- 3 years of working experience with PCB Design tools
- Experience with DFM Tools (Valor, CAM350), Allegro Skill scripting or Simulation tools
- Proficient with high-speed and RF board designs or layouts; familiar with high density ball-grid array (BGA), HDI and Anylayer layout design
- Familiarity with all phases of hardware development including schematic entry, manually generated constraints, requirements of the constraints and board layout
The Google Pixel team focuses on designing and delivering the world’s most helpful mobile experience. The team works on shaping the future of Pixel devices and services through some of the most advanced designs, techniques, products, and experiences in consumer electronics. This includes bringing together the best of Google’s artificial intelligence, software, and hardware to build global smartphones and create transformative experiences for users across the world.
Responsibilities
- Work with cross functional teams to set up the mechanical outline, stackup and PCB design rule constraints of the board.
- Execute component placement and routing of rigid boards and Flexible Printed Circuits (FPC) and Rigid flex board. Participate in design reviews providing expert recommendations as needed.
- Interface with vendors to select and use correct impedance rules, Design for Manufacturing (DFM), Design for Assembly (DFA) rules.
- Generate manufacturing files and address any internal or external DFM feedback.
- Work with Hardware Engineers, PCB Designers, Mechanical Designers and vendors for development and sustaining of actual products.
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最后期限: 20-12-2024
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