IC Carrier RD (Glass Interposer Package, GIP)

☞ Adecco

Ver: 171

Dia de atualização: 05-11-2024

Localização: Guishan District Taoyuan City

Categoria: Ciência Labor Alta tecnologia Mecânico / Técnico Elétrica / Eletrônica

Indústria: IT Services IT Consulting Software Development Financial Services

Posição: Entry level

Tipo de empregos: Full-time

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Conteúdo do emprego

Taiwanese-based global tier 1 IC Carrier & PCB manufacturer.

Responsibilities
  • Glass interposer technology study and development for advanced packaging and 5G application.
  • New materials and supplier evaluation and implementation.
  • Collaborate with global tier 1 IC Design House/Wafer Foundry for next generation IC carrier development.
  • Project delivery from NPI to Mass Production.
  • Spring TW* This job is agented by Spring Professional Taiwan, the Adecco Group company.
Experience

Education
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Data limite: 20-12-2024

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