IC Carrier RD (Glass Interposer Package, GIP)

작업 내용

Taiwanese-based global tier 1 IC Carrier & PCB manufacturer.

Responsibilities

• Glass interposer technology study and development for advanced packaging and 5G application.
• New materials and supplier evaluation and implementation.
• Collaborate with global tier 1 IC Design House/Wafer Foundry for next generation IC carrier development.
• Project delivery from NPI to Mass Production.
• Spring TW* This job is agented by Spring Professional Taiwan, the Adecco Group company.
  

Experience

Education