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IC Package Design Engineer, Sr
전망: 154
갱신일: 05-11-2024
위치: Hsinchu City
산업: Software Development Wireless Services Semiconductor Manufacturing
직업 종류: Full-time
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작업 내용
CompanyQualcomm Semiconductor Limited
Job Area
Engineering Group, Engineering Group > ASICS Engineering
Summary
General Summary:
The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc). Job responsibilities for this position include package selection, package design, and EE modeling. This role involves optimizing system co-design of IC-PKG-PCB keeping in mind package footprint/height constraints, IC floor-planning, PCB, SI, PDN and thermal constraints.
Job Description
- Responsible for package/SIP layout, optimization, design verification and taping out
- Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
- Interface and coordinate with cross-functional teams on new product package selection, feasibility analysis and design
- Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
- Package design implementing optimization of SI/PI and PDN performance.
- Master’s Electrical Engineering and/or Mechanical Engineering or equivalent experience
- Experience/familiarity with different types of package technologies ranging from QFN, Laminate, Modules, POP, etc
- Experience in IC package, SIP module and/or PCB design layout and DFM
- Experience in Pinmap optimization of optimal package, SIP module and/or PCB designs
- Hands on experience with Package layout tools like Cadence SIP and/or Mentor Xpedition, as well as DFM tools such as Cam350/Valor
- Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
- Knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory is a plus
- Familiar with assembly and substrate manufacturing process is a plus
- Excellent communication and interpersonal skills.
- Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field.
- 2+ years Hardware Engineering experience or related work experience.
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
If you would like more information about this role, please contact Qualcomm Careers.
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마감 시간: 20-12-2024
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작업 보고
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동일한 작업
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⏰ 05-12-2024🌏 Hsinchu City
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⏰ 05-12-2024🌏 Hsinchu City
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⏰ 05-12-2024🌏 Hsinchu City
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⏰ 05-12-2024🌏 Hsinchu City
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⏰ 05-12-2024🌏 Hsinchu City
-
⏰ 05-12-2024🌏 Hsinchu City