IC Package Design Engineer, Sr

Jobinhalt

Company

Qualcomm Semiconductor Limited

Job Area

Engineering Group, Engineering Group > ASICS Engineering

Summary

General Summary:

The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc). Job responsibilities for this position include package selection, package design, and EE modeling. This role involves optimizing system co-design of IC-PKG-PCB keeping in mind package footprint/height constraints, IC floor-planning, PCB, SI, PDN and thermal constraints.

Job Description

• Responsible for package/SIP layout, optimization, design verification and taping out
• Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
• Interface and coordinate with cross-functional teams on new product package selection, feasibility analysis and design
• Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
• Package design implementing optimization of SI/PI and PDN performance.
  
  

Preferred Qualifications

• Master’s Electrical Engineering and/or Mechanical Engineering or equivalent experience
• Experience/familiarity with different types of package technologies ranging from QFN, Laminate, Modules, POP, etc
• Experience in IC package, SIP module and/or PCB design layout and DFM
• Experience in Pinmap optimization of optimal package, SIP module and/or PCB designs
• Hands on experience with Package layout tools like Cadence SIP and/or Mentor Xpedition, as well as DFM tools such as Cam350/Valor
• Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
• Knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory is a plus
• Familiar with assembly and substrate manufacturing process is a plus
• Excellent communication and interpersonal skills.
  
  

Minimum Qualifications

• Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field.
• 2+ years Hardware Engineering experience or related work experience.
  
  

Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport

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