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ENGR SR PRIN, PACKAGE DEVELOPMENT_TL
Visualizza: 172
Giorno di aggiornamento: 05-11-2024
Località: Zhubei City Hsinchu County
Categoria: Alta tecnologia Meccanico / Tecnico Elettrico / Elettronico IT - Software
Industria: Electrical Electronic Manufacturing Information Technology Services Computer Software
Tipo di lavoro: Full-time
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Contenuto del lavoro
Job Descriptiononsemi is seeking a talent with highly motivation as the packaging integration engineer, to drive package development at the subcontractor factory. This role will be based on Hsinchu, Taiwan, and mainly work at the subcontractor factory.
As a member of corporate R&D packaging team, this role will drive NPI/NPD sensing package development including imaging, Lidar and Radar for sensing systems utilized in Automotive, Industrial and Consumer applications. In addition to working with the subcontractor, this candidate also needs to work with NPI engineers, external manufacturing engineers and reliability engineers to close the gap, when the technology is transferred to production.
Responsibilities include packaging process integration and characterization, statistical data analysis, new process assessment and advanced package technology development support.
- Cowork with the subcontractor on new package introduction/development
- Participate and lead in new package / platform process development and integration
- Perform package integrity analysis using appropriate tools
- Perform package characterizations and cost effectiveness studies
- Maintain product quality while developing on site monitoring
- Strong interaction with NPI/NPD engineers, design engineer, reliability engineer and external manufacturing engineers to close engineering gap and smoothly production transfer
- Master’s degree or above in Engineering, Physics or Chemistry
- Preferred year experiences: Master >10 years or PhD>5 years, in semiconductor assembly packaging development, process engineering, materials development and new package introduction/development
- Experience with imager packaging and related sensor packaging preferred
- Experience with wire bonding, multi-chip, BGA, flip chip packaging very desirable
- Possess a solid understanding of packaging materials and properties
- Experience with thermal and mechanical stress analysis preferred.
- Familiarity with AutoCAD and 3D modeling a plus.
- Proven experience utilizing statistical analysis techniques such as JUMP, DOE
- Understanding of package reliability requirements for consumer, industrial, medical, and automotive applications
- Strong project management and problem solving skills
- Bilingual in English and Mandarin Chinese
- Technically competent, self-motivated, confident, assertive and strong commitment
TW-TW-Zhubei
Work Locations
TWZC02 ON SEMICONDUCTOR TECHNOLOGY ZHUBEI OFFICE
Job
Engineering
Travel
Yes, 10 % of the Time
Job Posting
Sep 12, 2021, 6:24:30 PM
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Scadenza: 20-12-2024
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