ENGR SR PRIN, PACKAGE DEVELOPMENT_TL

Contenido de trabajo

Job Description

onsemi is seeking a talent with highly motivation as the packaging integration engineer, to drive package development at the subcontractor factory. This role will be based on Hsinchu, Taiwan, and mainly work at the subcontractor factory.

As a member of corporate R&D packaging team, this role will drive NPI/NPD sensing package development including imaging, Lidar and Radar for sensing systems utilized in Automotive, Industrial and Consumer applications. In addition to working with the subcontractor, this candidate also needs to work with NPI engineers, external manufacturing engineers and reliability engineers to close the gap, when the technology is transferred to production.

Responsibilities include packaging process integration and characterization, statistical data analysis, new process assessment and advanced package technology development support.

• Cowork with the subcontractor on new package introduction/development
• Participate and lead in new package / platform process development and integration
• Perform package integrity analysis using appropriate tools
• Perform package characterizations and cost effectiveness studies
• Maintain product quality while developing on site monitoring
• Strong interaction with NPI/NPD engineers, design engineer, reliability engineer and external manufacturing engineers to close engineering gap and smoothly production transfer
• Master’s degree or above in Engineering, Physics or Chemistry
• Preferred year experiences: Master >10 years or PhD>5 years, in semiconductor assembly packaging development, process engineering, materials development and new package introduction/development
• Experience with imager packaging and related sensor packaging preferred
• Experience with wire bonding, multi-chip, BGA, flip chip packaging very desirable
• Possess a solid understanding of packaging materials and properties
• Experience with thermal and mechanical stress analysis preferred.
• Familiarity with AutoCAD and 3D modeling a plus.
• Proven experience utilizing statistical analysis techniques such as JUMP, DOE
• Understanding of package reliability requirements for consumer, industrial, medical, and automotive applications
• Strong project management and problem solving skills
• Bilingual in English and Mandarin Chinese
• Technically competent, self-motivated, confident, assertive and strong commitment
  

Primary Location

TW-TW-Zhubei

Work Locations

TWZC02 ON SEMICONDUCTOR TECHNOLOGY ZHUBEI OFFICE

Job

Engineering

Travel

Yes, 10 % of the Time

Job Posting

Sep 12, 2021, 6:24:30 PM