技術工程類-Package Designer(邏輯/覆晶IC封裝)

Vue: 125

Jour de mise à jour: 05-11-2024

Localisation: Hsinchu County

Catégorie: Haute technologie Mécanique / Technique Electrique / Electronique Production/Opération

Industrie: Semiconductor Manufacturing

Niveau: Entry level

Type d’emploi: Full-time

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le contenu du travail

工作內容

職務說明：

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients.
Package RFQ and structure & BOM selection
Direct material evaluation and survey.
FA and Reverse Engineering.
Package design rule maintain & update.
Advance products design and development.
Research & setup package roadmap / material roadmap

工作待遇： NTD$30,000~NTD$50,000；資深人員薪資另議。

*實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。

上班地點：新竹工業區

管理責任：無需負擔管理責任

出差外派：無須出差

上班時段： 0830-1730

休假制度：週休二日

工作條件

Master’s or above degree with a major in Electronics / Electrical Engineering.

Over 5 years professional experience in IC Assembly R&D role, AiP/Logic IC design preferred.

Strong technical problem-solving and interpersonal skills.

Fluent in both oral and written English communication.

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