Packaging Development Engineer (Power Module)
Vue: 116
Jour de mise à jour: 05-11-2024
Localisation: Zhongshan District Taipei City
Catégorie: Haute technologie Mécanique / Technique Electrique / Electronique
Industrie: Semiconductor Manufacturing Industrial Machinery Manufacturing
Niveau: Mid-Senior level
Type d’emploi: Full-time
le contenu du travail
Job Description
• Packaging Development Engineer for automotive power electronic products with focus on power modules for electrical drives
• Package design and process development in co-operation with supplier and product engineering team.
• Developing solutions for assembly processes for automotive application.
• Coordination of sample manufacturing at assembly partner.
• Teamwork in English language with a multitude of international interfaces is mandatory.
Qualifications
• Experience in packaging/assembly of semiconductors including power semiconductors preferred
• Solid technical background in assembly technology
• Passion for developing technical solutions in multidisciplinary international projects
• Very good English skills and experience in international cooperation
• Ability to travel
Please apply via below link:
https://smrtr.io/fDzKc
Date limite: 20-12-2024
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