Packaging Development Engineer (Power Module)
Aussicht: 117
Update Tag: 05-11-2024
Ort: Zhongshan District Taipei City
Kategorie: Hohe Technologie Mechanische / Technische Elektrik / Elektronik
Industrie: Semiconductor Manufacturing Industrial Machinery Manufacturing
Position: Mid-Senior level
Jobtyp: Full-time
Jobinhalt
Job Description
• Packaging Development Engineer for automotive power electronic products with focus on power modules for electrical drives
• Package design and process development in co-operation with supplier and product engineering team.
• Developing solutions for assembly processes for automotive application.
• Coordination of sample manufacturing at assembly partner.
• Teamwork in English language with a multitude of international interfaces is mandatory.
Qualifications
• Experience in packaging/assembly of semiconductors including power semiconductors preferred
• Solid technical background in assembly technology
• Passion for developing technical solutions in multidisciplinary international projects
• Very good English skills and experience in international cooperation
• Ability to travel
Please apply via below link:
https://smrtr.io/fDzKc
Frist: 20-12-2024
Klicken Sie hier, um sich für einen kostenlosen Kandidaten zu bewerben
Job melden
ÄHNLICHE ARBEITEN
-
⏰ 05-12-2024🌏 Xinyi District, Taipei City
-
⏰ 05-12-2024🌏 Hsinchu City
-
⏰ 05-12-2024🌏 New Taipei City
-
⏰ 05-12-2024🌏 Banqiao District, New Taipei City
-
⏰ 05-12-2024🌏 Hsinchu City
-
⏰ 05-12-2024🌏 Hsinchu City
-
⏰ 05-12-2024🌏 Hsinchu City
-
⏰ 05-12-2024🌏 Banqiao District, New Taipei City
-
⏰ 05-12-2024🌏 Nangang District, Taipei City
-
⏰ 05-12-2024🌏 Kaohsiung City