Staff External Manufacturing Egr (OSAT)

Contenido de trabajo

Worldwide leading IDM company

Responsibilities

Responsibilities

• Provide engineering support and solution in driving project execution and completion within specified time frame.
• Ensure smooth project transition that meet Quality, Cost & Delivery requirement of Corporation.
• Capable to digest Project scope, objective and key deliverables. Analyze Project details and propose a comprehensive schedule
• Conduct comprehensive evaluation and qualification in accordance to Corporate Quality requirement.
• Dive into details, issues and support in providing engineering solution. Ensure smooth Project hand over.
• Work closely with Suppliers and determine optimum process condition through inclusive validation activity.
• Prepare all necessary analysis report and present for board approvals.
  

Industry: Semiconductor

#wirebond #diebond

• SpringTW*This job is agented by Spring Professional Taiwan, The Adecco Group company.
  

Experience

Requirements:

• At least 5 – 8 years experiences in related fields preferably in manufacturing semiconductor and familiar working with high-growth, fast-paced and changing work environment. Experience in supervisory roles would be an added advantage.
• Strong technical and manufacturing knowledge especially in Semiconductor Assembly.
• Strong skills in Assembly Process such as Wire Bond, Cu Wire, Materials and Cu Clips will be advantage.
• Good knowledge & skill in JMP tools
• Must possess product knowledge such as QFN, QFP, SOIC, FCBGA, Power Discrete & IC packages.
  

Education

• Bachelor’s Degree in Material, Science and Engineering or related field from recognized Higher Institution