Position: Entry level

Jobtyp: Full-time

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Jobinhalt

Worldwide leading IDM company

Responsibilities

Responsibilities
  • Provide engineering support and solution in driving project execution and completion within specified time frame.
  • Ensure smooth project transition that meet Quality, Cost & Delivery requirement of Corporation.
  • Capable to digest Project scope, objective and key deliverables. Analyze Project details and propose a comprehensive schedule
  • Conduct comprehensive evaluation and qualification in accordance to Corporate Quality requirement.
  • Dive into details, issues and support in providing engineering solution. Ensure smooth Project hand over.
  • Work closely with Suppliers and determine optimum process condition through inclusive validation activity.
  • Prepare all necessary analysis report and present for board approvals.
Industry: Semiconductor

#wirebond #diebond
  • SpringTW*This job is agented by Spring Professional Taiwan, The Adecco Group company.
Experience

Requirements:
  • At least 5 – 8 years experiences in related fields preferably in manufacturing semiconductor and familiar working with high-growth, fast-paced and changing work environment. Experience in supervisory roles would be an added advantage.
  • Strong technical and manufacturing knowledge especially in Semiconductor Assembly.
  • Strong skills in Assembly Process such as Wire Bond, Cu Wire, Materials and Cu Clips will be advantage.
  • Good knowledge & skill in JMP tools
  • Must possess product knowledge such as QFN, QFP, SOIC, FCBGA, Power Discrete & IC packages.
Education
  • Bachelor’s Degree in Material, Science and Engineering or related field from recognized Higher Institution
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Frist: 20-12-2024

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