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工作类型: Full-time
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工作内容
About DuPont Electronics & IndustrialOur industry-leading innovations, deep materials science expertise, and best-in-class manufacturing make next-generation technology a reality for our customers.
We’re pursuing new technologies and performance materials that enable your designs to be smaller, more complex, more reliable, and more powerful than you could ever imagine. DuPont is a technology leader, serving the semiconductor, circuit board, industrial, display, digital and flexographic printing, healthcare, aerospace, industrial and transportation industries. Every day, we’re solving our customers’ biggest challenges and are honored to be their partner of choice.
Learn more about our Featured solutions here https //www.dupont.com/about/our-businesses.html
Key Responsibilities
- Develop next generation conductive ink or adhesive for smart phone display or automotive display or other applications.
- Explore new adhesive platforms through patent landscape analysis, fundamental understanding, experiment design, data analysis, and result interpretation.
- Establish new methodology development and improvement to simulate customer in line test results/ issue, formulate products to solve customer technical challenges and communicate with customers.
- This role is responsible for collaborating with different functions including Application/Quality/scale-up Engineering/Manufacturing/EHS, etc., to deliver new products.
- PhD degree in Polymer chemistry/Chemical Engineering/Chemistry/Material Science is required.
- Experience in UV curing, moisture curing, UV-moisture curing or pressure sensitive adhesive are a plus.
- Experience in acrylic, polyurethane, epoxy or silicone type adhesive are a plus.
- Experience in adhesive containing inorganic or organic fillers are a plus.
- Experience in formulation development, DOE experience and industrial working experience is a plus.
- Independent researcher as well as team player.
- Strong interpersonal and communication skills.
- Fluent in English & Mandarin.
- Be able to travel to US and within Asia.
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最后期限: 20-12-2024
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