Mechanical Engineer

工作内容

Key Responsibilities

• Opto-Mechanical Design/Packaging Engineer developing 3DS packages and components for use in commercial systems

• Perform chip and package level thermal and stress simulation for VCSEL and edge emitter diode package

• Lead mechanical design of new product design and complex manufacturing tooling’s (e.g., mechanical/thermal/structural/component issues) from design through qualification phase

• Develop tooling/fixtures/equipment for reduced touch time, repeatability, and automation

• Select and interact with vendors for high performance and low cost components

• Transfer and qualify products and equipment to offshore CM

Qualifications:

• Knowledge of opto-mechanical design, (SolidWorks preferred) for developing 3DS products and assemblies (ranging from high reliability/stability to low-cost designs)

• Conceptual design, product prototyping and fixture/tooling design

• Knowledge in thermal and structural analysis using Finite Element Analysis (ANSYS preferred)

• Knowledge of GD&T and tolerance stack-up analysis is a plus

• Material selection/specifications, as applied to product design for good thermal dissipation and low stress

• Knowledgeable of low-cost Asian component suppliers

• Excellent communication skills are needed to contribute effectively in cross-functional teams and with suppliers

• Familiarity with lasers and VCSEL is a plus

• Education should be BS/MS in mechanical engineering or equivalent with 3+ years relevant experience