Lead Application Engineer

工作内容

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.Job Requirements:1. Master with 3 years working experience or Bachelor with 5+ years’ Layout experience in PACKAGE or PCB design, Cadence SPB platform experience will be a plus 2. Understanding of IR-drop analysis flow is required, including power calculation, static & dynamic IR-drop flow, package analysis is a plus3. Working experience with Skill/Libraries/Orcad/HDL, is plus 4. Good communication in English and Chinese, good confidence and good self-motivation.6. Good team spirit, well-aligned with the "One Cadence, One Team."

• Work in SPB team, focus on PACKAGE and PCB layout design. 2. Support customer engagements and sales to help on the business increase. 3. Working as a domain expert to well communicate with customers for their valuable feedbacks. 4. Co-work closely with R&D team to enhance the tool based on customers’ real demanding. 5. Instruction of Tool.

We’re doing work that matters. Help us solve what others can’t.