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工作类型: Full-time
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工作内容
Google welcomes people with disabilities.Minimum qualifications:
- Bachelor’s degree in Electronics or equivalent practical experience
- 5 years of experience in Computer Aided Design (CAD) or Printed Circuit Board (PCB) design
- 5 years of experience in Cadence PCB Design tools and Allegro Constraints Manager tools
- Experience with mechanical design outline formats
- Experience with high-speed and radio frequency (RF) board designs or layouts
- Experience with DFM Tools (Valor, CAM350, Fab3000), Allegro Skill scripting
- Familiarity with all phases of hardware development including schematic entry, manually generated constraints, requirements of constraints, and board layout
- Familiarity with high-density Ball-Grid Array (BGA), blind and buried vias
Our computational challenges are so big, complex and unique we can’t just purchase off-the-shelf hardware, we’ve got to make it ourselves. Your team designs and builds the hardware, software and networking technologies that power all of Google’s services. As a Hardware Engineer, you design and build the systems that are the heart of the world’s largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of Google users
Fitbit’s wide range of innovative products, including smartwatches, trackers, and a smart scale, help people lead healthier, more active lives by empowering them with data, inspiration, and guidance to reach their health and fitness goals. Coupled with our leading software and Fitbit Premium, our immersive platform experience delivers personalized experiences, insights, and guidance to support our users’ health and wellness. Fitbit’s mission has always been to help make everyone in the world healthier and now, as part of Google we’ll be able to make health even more accessible to everyone
Responsibilities
- Work with cross-functional teams to setup the mechanical outline, stackup, and constraints of the board
- Execute component placement and routing of rigid boards and Flexible Printed Circuits (FPC). Participate in design reviews providing expert recommendations as needed
- Interface with vendors to select and use correct impedance rules, Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Testability (DFT) rulesets
- Generate manufacturing files and address any DFM feedback
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最后期限: 20-12-2024
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