2024 Summer Intern Program : Software Engineer (軟體工程師)

工作内容

台灣應用材料暑期實習專案

• 申請資格：大學三年級(含)以上之在學學生(含碩士及博士生)；應屆畢業生即將進入職場者請勿投遞；若需繼續升學者請附上入學證明
• 申請文件 : 提供中英文履歷; 中文自傳(同步提供英文版更加分); 學校成績單; 專業認證證照或作品集
• 收件期間 : 2024/2/1 - 2024/4/15 (面試若符合資格，優先給予錄取通知)
• 附加條件：
• 實習期間：2024/7/1-2024/8/31。
• 實習期間之交通與住宿需自理。
• 實習期間，須全程參與，若無法承諾及配合，請勿投遞。
• 實習尾聲，須提交報告，分享實習成果，方可領取結業證書。並正式納入公司人才庫。
• 工作待遇：大學生月薪台幣38,500元，碩士生月薪台幣44,000元，博士生月薪台幣49,500元。
  
  

Key Responsibilities

• Intelligence analysis model establishment on end-to-end behaviors
• Application development by industry-wide standard protocol
• Maintain or develop support for programming tasks
• Provide insights and observation for semiconductor equipments’ complex operation, system track, and performance consistency
  
  

Requirements

• Skill : Python, JavaScript, node.js
• Knowledge : ETL, workflow design, data analysis, and API
• Experience : software development
• Education (Major/Degree) : Industry engineering /computer science degree (the fourth year of college students or above)
  
  

Qualifications

Education:

Skills:

Certifications:

Languages:

Years of Experience:

Work Experience:

Additional Information

Time Type:

Full time

Employee Type:

Intern / Student

Travel:

Not Specified

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.