Position: Entry level

Job type: Full-time

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Job content

Microcontrollers & Digital ICs Group (MDG) contributes to many of ST’s strategic goals for Industrial, Personal Electronics and Communications Equipment. MDG represents about one third of ST’s business.
MDG represents around 3000 employees (mainly R&D teams in France) located in 40 countries, with a revenue of above
3 billion dollars in 2020. It is addressing 2 major activities: first, General Purpose (GP) Microcontrollers, Memories and Secure Micro (MMS Subgroup) covers all products based on Non-Volatile Memory technologies. It represents 80% of MDG business and second, The RFC Sub-Group focusing on Radio Frequency, Digital & Mixed Signals activities, represents 20% of MDG business.
After a stay of 4 to 6 weeks on our site of Rousset (France), you will work within Backend operation engineering team of SMD Division from MDG group, a major worldwide actor Secure Microcontrollers IC’s, on our site of Hsinchu in Taiwan. The Secure Microcontroller Division develop products and solutions to protect your privacy and your assets by ensuring their confidentiality, their integrity and their availability to authorized users.
We deliver hardware-certified and software-certified solutions, offer full integration of security features, and are experts in cryptography and secure device architecture. The position is an exciting opportunity to be part of a flexible and dynamic team in the growing markets of secure microcontrollers used in state-of-the-art secure applications addressing IOT, Mobile, Banking, Identity & transport, Brand protection and automotive.
Close to BE plants and central functions locations, you will support division on Technical support and development for package and CPI in relation with MDG central BE, BEMT and CPI organization to support ST BE and OSATs. The technical mission also include package development, BE recipe and BOM development as well as support for quotations for SMD business.
You will contribute to New Product introduction by checking Front End/ Back End Compatibility and/or asking new process brick and/or package development and validating implementation in Back End Plant
You will support package road map by checking feasibility, robustness and industrialization
Your contribution to BE program will consist in supporting Change in Manufacturing, assuring Best Practice Deployment and Implementation in Back End Plant, working on Yield Improvement & Cost Reduction.
You will ensure technical support :
- To Quality Department in case of Customer Claim, Problem Solving.
- To Marketing Department for Customer specific Demand.
- To Design & Application Department in term of package electrical & thermal performance.
- To Operations as entry point with BE Plant for package outlines, process flow chart, packing.
- To Technical Writer for Package information Integrity and Data Sheet.

Your profile:

- A first experience in project management in a industrial environment is appreciated.
- Knowledge in electronic and materials required.
- Need to be well organized with tasks and priority definition in order to fit with targets.
- Communication skills with counterparts dealing with large skills portfolio and multi service is key.
- Flexibility and adaptation to local teams to build network is part of the job.
- High level of autonomy due to far office vs. division
- Fluent in English and volunteer to learn Chinese.

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Deadline: 20-12-2024

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