Staff External Manufacturing Egr (OSAT)

Job content

• As Technical Lead and contact window for NPD & site transfer (External and Internal) in the external manufacturing organization (Backend)
• Lead cross functional team (comprising both internal and external stakeholders) for NPD & site transfer projects through product/ process/ manufacturing gap analysis, risk assessment and mitigation to achieve process robustness, 1st pass qualification and flawless production ramp
• Establish technical excellence, Best Known Methods (BKM) and Best-in-Class practices through collaboration with sending/ receiving site for assembly performance benchmarking, process control, yield improvement and fan-out lesson learnt
• Prepare and manage assembly sites manufacturing readiness to ensure smooth production release, including safe-launch activities. Support on-site troubleshooting and resolution of process issues
• Support strategic outsource programs to meet evolving business needs and supply demand.
• Participate in quality and process readiness audit at receiving sites to achieve manufacturing readiness prior to production release
• Co-work with operations to drive continuous yield improvement
  
  

• Bachelor’s Degree in Engineering/ Materials Science or equivalent technical background
• More than 8 years of experience in backend semiconductor IC manufacturing environment, with in-depth process expertise and shop floor experience in one or more key processes such as Wafer Processing, Die Attach, Wire-bonding and IC Molding etc
• Hands on experience in driving assembly device startup/ technology transfer from conceptualization, characterization, qualification to HVM
• Experience in IC package design/ CAD/ simulation will be highly advantageous
• Track record of leading cross-functional team, strong engineering fundamentals (including DOE characterization)