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Senior Principal Package Engineer
View: 291
Update day: 05-11-2024
Location: Hsinchu County Zhubei City
Category: Electrical / Electronics Mechanical / Technical High Technology Design - Web
Industry: Semiconductor Manufacturing
Position: Mid-Senior level
Job type: Full-time
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Job content
Job Description
- Lead imager package product design activities including: schematic and package netlist definition; package circuit layout; package simulations; package design review and approval; and package product performance verification.
- Provide direct design support for imager package product designs including wire bond BGA, MCP (multichip package) and WLCSP (wafer level chip scale package).
- Work directly with Product Design, Design Integration, Product Engineering, Test Engineering, Applications Engineering, Hardware Development, Marketing, Packaging R&D, Packaging NPD, Purchasing, OSAT’s, and key package material suppliers.
Qualifications
- Bachelor or Master degree in Electrical Engineering, Mechanical Engineering, or Engineering related.
- 8+ years experience in package and/or hardware system design, assembly process engineering, and new product development.
- Package/PCB layout experience using Cadence APD/SIP required.
- Signal/Power/Ground integrity experience and familiarity with simulation tools such as Cadence Sigrity Package Assessment, ANSYS Q3D, and ANSYS HFSS.
- Mechanical design experience using AutoCad and Solid Works.
- Solid understanding of packaging assembly process and material properties.
- Experience with thermal and mechanical stress simulation using finite element analysis.
- Strong project management and problem solving skills required.
- Able to work independently and interact with multinational team members.
- Bilingual in English and Mandarin Chinese.
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Deadline: 20-12-2024
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