Position: Mid-Senior level

Job type: Full-time

Loading ...

Job content

Job Description

  • Lead imager package product design activities including: schematic and package netlist definition; package circuit layout; package simulations; package design review and approval; and package product performance verification.
  • Provide direct design support for imager package product designs including wire bond BGA, MCP (multichip package) and WLCSP (wafer level chip scale package).
  • Work directly with Product Design, Design Integration, Product Engineering, Test Engineering, Applications Engineering, Hardware Development, Marketing, Packaging R&D, Packaging NPD, Purchasing, OSAT’s, and key package material suppliers.

Qualifications

  • Bachelor or Master degree in Electrical Engineering, Mechanical Engineering, or Engineering related.
  • 8+ years experience in package and/or hardware system design, assembly process engineering, and new product development.
  • Package/PCB layout experience using Cadence APD/SIP required.
  • Signal/Power/Ground integrity experience and familiarity with simulation tools such as Cadence Sigrity Package Assessment, ANSYS Q3D, and ANSYS HFSS.
  • Mechanical design experience using AutoCad and Solid Works.
  • Solid understanding of packaging assembly process and material properties.
  • Experience with thermal and mechanical stress simulation using finite element analysis.
  • Strong project management and problem solving skills required.
  • Able to work independently and interact with multinational team members.
  • Bilingual in English and Mandarin Chinese.
Loading ...
Loading ...

Deadline: 20-12-2024

Click to apply for free candidate

Apply

Loading ...

SIMILAR JOBS

Loading ...