Senior Packaging Engineer

Job content

Synaptics is looking for a Sr. Staff Packaging Engineer to join our dynamic and growing organization. You will be responsible for all touch and driver IC backend process activities including Bump/Tape and COG/COP/COS/COF and product and package technology engineering and development. You will be the key interface with suppliers and design teams for product cost, quality, manufacturability, and testability. This position reports to the Sr. Manager, Package Engineering.

Millions of people experience Synaptics every day. Our technology impacts how people see, hear, touch, and engage with a wide range of IoT applications -- at home, at work, in the car or on the go.

We solve complex challenges alongside the most influential companies in the industry, using the most advanced algorithms in areas such as machine learning, biometrics and video processing, combined with world class software and silicon development.

Responsibilities

Job Duties

• Assume responsibility of all DDIC/TDDI backend process activity including Bump/COG/COP/COF and product and package technology engineering and development
• Act as key interface with supplier and design teams during product concept phase to establish product requirements for success around product cost, manufacturability, and testability
• Support the touch and display driver IC design ins
• Lead the failure analysis and resolution of customer issues with DDIC/TDDI products; drive test and supplier teams to determine root cause, containment, and help implement ultimate solution
• Lead product NPI efforts, product and package qualification and support production test readiness
• Drive best possible product margins by having close alignment with procurement and suppliers on yield improvement and supplier cost
• Participate in the establishment and monitoring of the supplier quality assurance, coordination, follow-up and improvement of abnormal product quality
  

Competencies

• Effective communication skills with both internal teams and externally at foundries and assembly/test suppliers
• Analytical and able to make informed decisions based on experience and data
• Highly analytical with strong process, design, and test acumen
• Ability to work under high pressure with a strong sense of accountability
• Flexible and creative problem-solving skills
• Proactive, self-starter, able to work independently in a fast-paced environment to complete projects on time with minimal guidance
• Well organized with strong attention to detail; proactively ensures work is accurate
• Positive attitude and work ethic; unafraid to ask questions and explore new ideas
• Resourceful and able to solve complex problems through adaptation of existing technology and investigation of new technology to resolve complex problems
• A great teammate who is passionate about developing and being part of a high functioning team and company
  

Qualifications

Requirements

• Bachelor’s degree in Engineering or Science or related field or equivalent
• 12 years’ experience in display and touch driver IC products using COG/COF/COS/COP technologies
• Hands on experience working with leading suppliers on touch and display driver IC from wafer foundry through tape design, backend bumping, bonding, dicing, and testing
• Background in product and test engineering
• Experience in semiconductor failure analysis and quality systems including automotive QA systems
• Familiar with NPI and mass production sustaining procedures
• Familiar with underfill process impact on this class of products
• Familiar with high voltage IC technologies and process features
• Familiar with DOE/Statistics/QA/8D and FA skills
• Fluency in English (spoken and written); fluency in and Japanese is preferred
• Highly proficient in using tools and reports to track progress and make timely course corrections
• Familiar with Display/Touch panel system application
• Ability to travel internationally up to 10%
  

Belief in Diversity

Synaptics is an Equal Opportunity Employer committed to workforce diversity. Qualified applicants will receive consideration without regard to race, sex, sexual orientation, gender identity, national origin, color, age, religion, protected veteran or disability status, or genetic information.