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3D Sensing Package Reliability Engineer
Ver: 201
Dia de atualização: 05-11-2024
Localização: New Taipei City
Categoria: Alta tecnologia Mecânico / Técnico Elétrica / Eletrônica IT - Software
Indústria: Electrical Electronic Manufacturing Information Technology Services Mechanical or Industrial Engineering
Posição: Entry level
Tipo de empregos: Full-time
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Conteúdo do emprego
It’s fun to work in a company where people truly BELIEVE in what they’re doing!We’re committed to bringing passion and customer focus to the business.
If you like wild growth and working with happy, enthusiastic over-achievers, you’ll enjoy your career with us!
Key Responsibilities
- Work closely with US team and local team on 3D sensing laser and sensor package development for consumer and automotive applications
- Drive product reliability test plan and execution, data analysis, report, and failure analysis for new product, process, or component qualification.
- Work with internal reliability team and contract or partner manufacturers to execute new product qualification tests, summarize reliability test data and write up report.
- Perform failure analysis and report
- Work with quality team on production ORT plan and execution.
- Collaborate with engineering team to ensure DOE, SPC, and FMEA tools are used regularly throughout product life cycle
- Communicates/contributes effectively in cross-functional teams (such as manufacturing, quality and supply-chain management)
- Support PLMs and FAEs for product marketing and customer qualification on reliability and eye safety support.
- Experience in optoelectronic and microelectronics package qualification and reliability tests for consumer and automotive applications..
- Familiarity of product reliability/qualification standards for consumer and automotive applications (such as AEC qual standard), experience in product qualification reliability tests
- Familiarity with package and component assembly process such as die bonding (solder, epoxies), flip chip assembly, wire bonding, sealing, SMT processes.
- Knowledge on photonics submount, housing, laser diodes, LEDs, photodetectors, driver ICs, and optical components (lenses, diffusers, DOEs).
- Experience in working with Contract Manufacturers (CM) and knowledge of reliability test equipment and process.
- Experience in development and manufacturing of high-volume (>10M units/yr), low-cost laser, LED or camera packaging for consumer or automotive applications is preferred
- Strong written and oral communication skills
- MS/PhD in optoelectronic or related areas with 5+ years of experience in optoelectronic, laser/LED/camera packaging
- Fluent in English & Mandarin (both oral & written)
- Ability to travel internationally
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Data limite: 20-12-2024
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