Product packaging engineer

Job content

Job Description

Product Packaging Engineer goal is to ensure quality output at lowest cost in high volume manufacturing for package assembly and bumping process at Intel Outsourced Assembly and Test (OSAT) manufacturing facilities.

This includes working closely with Intel internal and well as external OSAT team in close collaboration in technology development and new product introduction (NPI) to develop and transfer the process technology from NPI to Ramp, and ramping the volume production to sustain stable high volume manufacturing.

Successful candidate will role model collaboration across boundaries with inclusive and result oriented mindset, identify risks, priorities, fixes, and demonstrate progress to key milestones to meet Ramp and HVM goals.

Responsibilities including, but not limited to

Early engagement with NPI team to development robust assembly and bumping technology for high volume manufacturability.

Ensure successful transition from NPI to Ramp, and Ramp to HVM.

Identify opportunities and drive process yield, quality improvements, change control, and excursion management.

Develop yield and quality dashboards to monitor inline defect performance by using data visualization to actionable items for finding root cause for inline defect, quality, and implement fixes to address yield and quality issues.

Actively drive affordability and value engineering.

Identify and enable systems to mine and analyse data for faster data to action.

Develop solutions to problems by utilizing formal education, knowledge of manufacturing process, statistical knowledge, and problem-solving tools.

Independently drive recommendations and implement the Process, Quality and Yield improvement roadmap.

Qualifications

Minimum Qualifications. 1. Bachelor’s/master’s degree in Mechanical engineering, Material Engineering, Information Systems, Computer Science, Industrial Engineering, Data Science or a related field. 2. One to 3 years of industry experience as a packaging engineer with basic familiarity with various packaging process and technology for Flip Chip CSP, Flip Chip BGA. 3. Basic knowledge of assembly process, microelectronic packaging materials, reliability standards and failure analysis. 4. Experience as a data analyst, data engineer, solution analyst or similar domains is an added advantage. 5. Capable to work with stakeholders including the users, cross functional teams to support their data organization and display needs. 5. Proficiency in Python programming and experience with Web-based frameworks like Flask. 7. Familiarity with data visualization tools such as PowerBI. 8. Excellent written and verbal communication skills in English. Preferred Qualifications: 1. Proficiency in SQL to build complex queries and perform data manipulation, aggregation, and transformation tasks. 2. Strong problem-solving skills and the ability to tackle complex data-related challenges.

Inside this Business Group

Intel’s Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

In certain circumstances the work model may change to accommodate business needs.