[Semiconductor] Package Manager

Job content

Our client is looking for a Package Manager in Hsinchu City.Key Responsibilities

• Responsible for the packaging and substrate technology for performance and cost-effective improvement
• Evaluate the packaging and substrate types required for new products, assess the engineering capabilities of OSAT, and support the cost and capacity strategy direction of the PP team
• Supervise the packaging certification/verification required for products and provide guidance to solve problems
• Provide engineering support during customer NPI phase
• Collaborate with QA team to provide engineering support for DPPM-related issues during customer MP phase
• Lead a team and provide guidance to team members

Key Requirements

• 10+ years of professional experience in IC packaging/ substrate design
• Experience in fabless industry
• Familiar with flip-chip packaging technology, CSP/BGA
• Strong communication and coordination skills across departments
• Team management experience is a big plus