Mechanical Engineer

Job content

Company

Qualcomm Semiconductor Limited

Job Area

Engineering Group, Engineering Group > Hardware Engineering

General Summary

Qualcomm Technologies Inc. is focused on inventing technologies that connect and empower people in ways that are elegant and accessible to all. QTI is actively seeking mechanical engineering candidates to join the QCT Product & Test engineering (PTE) team in Taiwan. This team is responsible for developing hardware to support all engineering development and production test activities at Qualcomm.

In this role, the mechanical engineer is responsible for collaborating with multiple global engineering teams to ensure the overall design of hardware in support of product characterization and test of semiconductor devices. It will require considering all aspects of the final design from the perspective of how the designs will function within the target test platform.

This is an exciting opportunity for a mechanical engineer to play a key role in designing hardware that will directly impact the successful testing of cutting-edge semiconductor devices that will enable our customers’ various Mobile, 5G, Automotive, Internet of Things, and Compute applications.

This role is highly interdisciplinary and offers excellent opportunities for technical growth, cross-functional networking, and a chance to help drive industry-leading digital wireless technology into the future! The Product and Test Engineering group is considered the last line of defense before a product can be launched. As such, we take pride in the work we do and enjoy the opportunity to see the hardware we design and support being used by test engineers on some of the most advanced test applications to date.

If this sounds like something you see yourself being a part of, then please check out some of the core responsibilities below.

Responsibilities

• Plan, conceptualize, and design mechanical hardware using advanced CAD modeling tools to support multiple product test engineering platforms (wafer-probe, automated test equipment (ATE), different types of chipset integration development platforms, and system-level test platforms (SLT), among others).
• Perform engineering calculations, tolerance stackup analysis, GD&T to support design work
• Create and review technical drawings, plans, and specifications
• Communicate and collaborate with engineering leads and/or vendors to capture relevant design requirements and work with Operations Team to support high volume testing.
• Detect/ troubleshoot deflection, stress, thermal, and thermo-mechanical risks using ANSYS modeling tools and provide design solutions to support high volume testing.
• Utilize product lifecycle management software tools for generating engineering change orders (ECOs)
• Create guidelines, documentation, assembly instructions, and tools to support design process and success
  
  

Minimum Qualifications

Bachelor’s degree in Mechanical Engineering, or related field.

1+ years’ Mechanical Engineering experience or related work experience

Preferred Qualifications

2 + years’ experience in the following areas:

• Knowledge of semiconductor test cell technology and operation and associated hardware design experience
• Solid background in mechanical design, part fabrication techniques, application of geometric tolerancing and dimensioning (GD&T) best practices per ASME Y14.5-2009,
• Familiarity with ANSYS mechanical and/or thermal modeling software tools
• Proficiency using Creo Parametric 3D modeling CAD software tool utilizing top-down assembly methodologies
• Experience conducting tolerance stack-up analysis on complex assemblies
• Experience with automated test equipment and probe/socket design experience will be preferred.
• Familiarity with Project Lifecycle Management (such as Agile)
• Excellent English and Mandarin communication.
  
  

Education

Minimum Qualifications

Bachelors - Computer Science, Bachelors - Engineering, Bachelors - Information Systems

Certifications

Work Experiences:

Skills

Preferred Qualifications

Education

Work Experiences:

1+ years experience utilizing schematic capture and circuit simulation software. ,1+ years experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, RF tools, etc. ,1+ years experience with circuit design (e.g., digital, analog, RF).

Skills

Computer Science, DSP Architectures, Electrical Engineering, Optical Systems, Packaging Systems

Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport

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