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Principal Engineer, Package Engineering - Marvell
전망: 261
갱신일: 05-11-2024
위치: Taichung City
범주: 첨단 기술 기계 / 기술 전기 전자 IT-소프트웨어
산업: Electrical Electronic Manufacturing Computer Software Semiconductors
수평: Associate
직업 종류: Full-time
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작업 내용
The OpportunityThe package engineering team drives semiconductor package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design that results in the delivery of engineering samples and a subsequent production ramp-up. There is the excitement of always working on new projects and cutting-edge technologies.
Responsibilities
- Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product. Working closely with cross functional teams – BU, CE, QA and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality and reliability.
- Manage and mentor junior engineers
- Perform package design review.
- Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual.
- Provide inputs to design guidelines and drive to implement the guidelines.
- Achieve milestone dates for all NPI schedules.
- Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues.
- Work with procurement and suppliers on package cost analysis.
- Provide inputs to the package technology roadmap. Support new package and technology development.
- Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience.
- Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience.
- Experienced with flip-chip package development and substrate review.
- Basic Cadence APD and AutoCAD skills
- Expert understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques.
- The ideal candidate would be knowledgeable of 2D, 2.5D, 3D and wafer-level packaging.
- Good communication skills that can enable the candidate to work well with internal cross functional teams and suppliers.
- Good program management skills . OSAT management experience is a plus.
- People management experience.
- Ability to work independently, provide leadership and to exercise discretion to solve complex problems as the owner of key deliverables and milestone dates.
With competitive compensation and great benefits, you will enjoy our workstyle within an incredible culture. We’ll give you all the tools you need to succeed so you can grow and develop with us. For additional information on what it’s like to work at Marvell, visit our page.
Your Future
Marvell provides a work environment that promotes employee growth and development. We are searching for an individual who wants to grow with the company and will strive to improve performance. If you are driven, personable, and energetic, there will be additional opportunities for you here at Marvell.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
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마감 시간: 20-12-2024
무료 후보 신청 클릭
작업 보고
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