Packaging Development Engineer (MEMS products)

작업 내용

Job Description

- Packaging Development Engineer for MEMS products

- Package design and process development in co-operation with supplier and product engineering team for electronic sensors.

- Developing solutions for assembly processes of MEMS for automotive and consumer application.

- Coordination of sample manufacturing at assembly partner.

- Team work in English language with a multitude of international interfaces is mandatory.

Qualifications

- 3-8 Years experience in packaging/assembly of semiconductors components, especially familiar with LGA, BGA, and WLCSP packages.

- Preferred Solid technical background in assembly technology

- Passion for developing technical solutions in multidisciplinary international projects

- Experience in international corporation

- Ability to travel

- Very good English skills

- Good team work with multitude of international interfaces

Please apply via below link:

https://smrtr.io/7jbDj