Package Test Development Engineer

작업 내용

Company

Qualcomm Semiconductor Limited

Job Area

Engineering Group, Engineering Group > ASICS Engineering

General Summary

The position is focused on working with leading semiconductor wafer foundries and IC package assembly factories to develop innovative mechanical testing methodologies in support of Qualcomms advanced packaging technologies. This engineer will be responsible for thermal mechanical materials characterization, mechanical test development, surface topography measurement and methodologies to validate process and design improvements of IC package materials and interconnect technologies. The candidate is expected to interact closely with suppliers and internal teams to deliver high quality and novel testing solutions for Qualcomm products.

Minimum Qualifications

• Min 6+ months experience with IC package assembly and materials; experience with mechanical and analytical lab equipment; experience with digital multi-meters
• Development experience with advanced IC package applications in areas such as: material selection, assembly process development, product qualification and reliability, IC package characterization, and failure analysis.
• Experience using test methodologies such as: Thermal mechanical and Dynamic mechanical analyze, High temperature warpage measurement, Bump mechanical test, Nano-scale mechanical test, Surface topography measurement, and Universal mechanical testers.
• Ability to perform package structural analysis via techniques such as Cross-section, Optical/IR/Acoustic/Electron microscopy, X-ray, and Surface topography measurement
  
  

Preferred Qualifications

• Test methodology development to validate process improvements, structural interactions, and robustness
• Laboratory management experience
• Knowledge of ASTM, MIL-STD, JEDEC, IPC, ISO, AEC or relevant industry specification related to IC packaging and interconnect technology
• Experienced with JMP, ReliaSoft, or equivalent statistical analysis software
• Excellent analytical and project management skills with ability to manage external manufacturing resources
• Exceptional communication skills and experienced in publishing technical reports to broad audiences - Able to work flexible hours with occasional domestic/international travel (< 10%)
• Fluent in Mandarin and functional in English
  
  

Education Qualifications

• Required: Bachelor’s, Materials Science and/or Mechanical Engineering
• Preferred: Master’s, Materials Science and/or Mechanical Engineering
  
  

Physical Requirements

• Frequently transports between offices, buildings, and campuses up to ½ mile.
• Frequently transports and installs equipment up to 5 lbs.
• Performs required tasks at various heights (e.g., standing or sitting).
• Monitors and utilizes computers and test equipment for more than 6 hours a day.
• Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.
  
  

Education

Minimum Qualifications

Bachelors - Engineering, Bachelors - Science

Certifications

Work Experiences:

Skills

Preferred Qualifications

Education

Bachelors - Computer Engineering, Bachelors - Computer Science, Bachelors - Electrical Engineering

Work Experiences

6+ months experience with architecture and design tools. ,6+ months experience with scripting tools and programming languages. ,6+ months experience with design verification methods.

Skills

ASIC Verification, Matlab C, Multicore System-On-Chip (SoC), Perl Programming, Simulation Software

Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport

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