Package Engineer

작업 내용

※ Job Contents:

1. Work with GUC’s customers to define a competitive packaging solution.

2. Package design and the related actions follow up.

3. Work with GUC signal integrity engineer, substrate designer and thermal designer to come up with a cost effective package.

※ Requirements:

1. MS degree in ME, EE, or relevant fields

2. Familiar with Cadence Allegro Package Designer, Autocad

3. Familiar with PBGA/TFBGA/FlipChip/POP/PiP/SiP/Module/3DIC

4. Fluent in English is a plus