IC Packaging Engineer

작업 내용

Summary

Imaging what you could do here. At Apple, creative ideas have a way of becoming wonderful products, services, and customer experiences very quickly. Bring passion and dedication to your job and there’s no telling what you could accomplish. We believe this is an excellent opportunity to work on the New Technology project in the exemplary company consistently bringing innovations in the industry.
Apple is seeking for a senior level IC packaging engineer who can bring packaging solution from concept to high-volume manufacturing to develop exciting new products. Your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies.


Key Qualifications

In-depth knowledge in flip-chip or large body size package, substrate and assembly materials. Knowledge in wafer BEOL or wafer bumping is a plus.
Hands-on knowledge in key assembly building blocks such as die attach, thermal compression or laser assisted bonding and underfill dispense.
Good understanding in device physics and component/board level reliability testing.
Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.
Flexibility and comfort working in a quickly changing environment.


Description

You will define new package special characteristics based on unique module and system level performance, cost, and footprint requirements. Define package/packaging specifications.
Work with assembly suppliers on package design, new material, new equipment selection and process/process flow development. Perform initial proof of concept sample build, POR establishment, package and process qualification, reliability test, yield analysis and enhancement.
Interface and coordinate with other packaging team members to comply with product development/ramp schedule. Deliver package/packaging milestones on time.
Define packaging roadmap based on long term packaged product requirements. Work closely and Manage suppliers’ R&D activities.
At least 5~10% travel to domestic and international locations.


Education & Experience

M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 15 years of experience in IC packaging.


Additional Requirements

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.


Role Number: 200045598