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Failure Analysis Engineer to Senior
전망: 199
갱신일: 05-11-2024
위치: Hsinchu City
산업: Software Development Wireless Services Semiconductor Manufacturing
직업 종류: Full-time
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작업 내용
CompanyQualcomm Semiconductor Limited
Job Area
Engineering Group, Engineering Group > Failure Analysis Engineering
General Summary
Evaluates the electrical and mechanical characteristics of systems and/or integrated circuits, components, and sub-components to determine the cause of failure, including the verification of analog and digital performance. Analyzes failure reports, identifies the root causes of issues, and recommends corrective action. Develops methods, processes, procedures and equipment that will improve the failure analysis process and/or reduce failures.
Minimum Qualifications
- Bachelor’s degree in Science, Engineering, or related field and 2+ years of chip-level Failure Analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) or related work experience.
Master’s degree in Science, Engineering, or related field and 1+ years of chip-level Failure Analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) or related work experience.
OR
PhD in Science, Engineering, or related field.
- 2+ years working in a physical/chemical laboratory setting.
- Frequently transports and installs equipment up to 25 lbs.
- Performs required tasks at various heights (e.g., standing or sitting).
- Frequently transports between offices, buildings, and campuses up to ½ mile.
- Monitors and utilizes computers and test equipment for more than 6 hours a day.
- Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.
- 4+ years chip-level Failure Analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) experience or related work experience.
- Performs failure analyses on somewhat complicated issues (e.g., level 2) requiring creative problem solving and patience.
- Applies a moderately advanced knowledge in an area of failure analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing, etc.) to solve problems, and seeks resources from other teams to find alternatives.
- Performs physical failure analyses by examining individual layers of silicon to reveal evidence of defect. May contribute to some high-risk, isolated issues in which analysis can only be performed once on a single device.
- Conducts advanced electrical fault isolation analyses to localize ’hot spots’ and isolate location of defect.
- Administers non-destructive testing on devices using imaging tools (e.g., X-ray, C-SAM) and/or optical inspections.
- Contributes to writing papers and publications documenting failure analysis approaches.
- Documents results of failure analysis, reports identified root cause, and delivers conclusions to requesters.
- Determines type of failure analysis needed to identify a reported issue and conducts appropriate analysis with minimal guidance.
- Acts as the case owner for one or more complicated defects and handles all issues relevant to the case.
- Participates in process improvement to gain efficiencies or development initiatives and identifies innovative methods for identifying and/or preventing defects.
- Coordinates with partners in other teams (e.g., design team, product team) to share device issues and work toward solutions.
- Working under some supervision.
- Making decisions that are moderate in impact; errors may have relatively minor financial impact or effect on projects, operations, or customer relationships; errors may require involvement beyond immediate work group to correct.
- Using verbal and written communication skills to convey information that may be somewhat complex to others who may have limited knowledge of the subject in question. May require basic negotiation and influence, cooperation, tact, and diplomacy, etc.
- Having a moderate amount of influence over key organizational decisions (e.g., is consulted by senior leadership to provide input on key decisions).
- Completing tasks with multiple steps that can be performed in various orders; some planning and prioritization must occur to complete the tasks effectively; mistakes may result in some rework.
- Exercising creativity to draft original documents, imagery, or work products within established guidelines.
- Using deductive and inductive problem solving; multiple approaches may be taken/necessary to solve the problem; often information is missing or incomplete; intermediate data analysis/interpretation skills may be required.
- May be solicited during strategic planning period.
- Financial accountability (e.g., does not involve budgeting responsibility).
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If you would like more information about this role, please contact Qualcomm Careers.
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마감 시간: 20-12-2024
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동일한 작업
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⏰ 05-12-2024🌏 Hsinchu City
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⏰ 05-12-2024🌏 Hsinchu City
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⏰ 05-12-2024🌏 Hsinchu City
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⏰ 05-12-2024🌏 Hsinchu City
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⏰ 05-12-2024🌏 Hsinchu City
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⏰ 05-12-2024🌏 Hsinchu City