Advanced Interconnect Application Engineer

작업 내용

• As an Advanced Interconnect Application Engineer, you will have to apply our products at the world’s leading semiconductor and IC substrate fabricators . Your primary responsibility is to secure technical design wins for our products and service offerings. Specifically, you will be responsible for technical wins with the industry leaders in IC substrate and advanced packaging.
• Responsible activities will include delivery of technical presentations, conducting product demonstrations and benchmarks, and participation in development of account strategies leading to market share gains. Your territory coverage consists of key accounts located. You will be responsible for integrating with cross function teams located all over the world, communicating essential status to a variety of stakeholders.
• MS degree or above in Chemistry/Chemical Engineering/Material Science.
• Familiar with High Density Interconnect (HDI) PCB and Flip-Chip (FC) BGA package substrate technologies.
• Willing to tackle tough problems.
• General understanding of packaging technologies, IC packaging materials, reliability standards, FA techniques, etc.
• Possess a passion to learn and perform at the cutting edge of technology.
• Ability to work independently and work with multi-functional teams.
• Good program management skill.
• Fluent in English & Mandarin.
• Good computer proficiency.