Senior Staff Engineer, Package Engineering

仕事内容

About Marvell

At Marvell, we believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. Trusted by the world’s leading technology companies for 25 years, we move, store, process and secure the world’s data with semiconductor solutions designed for our customers’ current needs and future ambitions. Through a process of deep collaboration and transparency, we’re ultimately changing the way tomorrow’s enterprise, cloud, automotive, and carrier architectures transform—for the better.

The data infrastructure that our customers build has never been more critical to our global economy. It’s what’s keeping the world connected, businesses running, and information flowing. If you’re ready to excel, innovate, and truly enjoy your work, apply now for the position detailed below.

The Opportunity

Package Engineering

Job Responsibilities

Marvell is a data infrastructure technology company. It moves, stores, processes and secures the world’s data with semiconductor solutions in enterprise, cloud, automotive, and carrier markets.

Be a part of the engineering team that enables the connected digital lifestyle. We are the package engineering team that drives semiconductor package development from concept to mass production.

You are the talented individual who we are looking for to make an impact from Day One.

• As package development lead and work closely with cross functional teams – Sales & Marketing, Si design teams, QA and Product engineering – to develop and provide high performance, cost effective, reliable and manufacturing friendly IC packaging solutions.
• Support both NPIs and 2nd source development
• Work as the expert of manufacturing including both Assembly and substrate fabrication, Perform package substrate layout review using APD.
• Manage and drive OSAT and substrate suppliers on risk assessment, design review/modification and substrate design release.
• Work with QA, OSAT and substrate suppliers to resolve package related quality/reliability issues.
• Apply engineering knowledge of substrate fabrication/assembly to develop new packages or new technologies. Implement DFX. Drive assembly process and yield improvements and prevent quality/reliability issues.
  

Requirements

• Min. bachelor’s degree in engineering. EE or ME master’s degree preferred.
• Minimum 5 years flip-chip package development and substrate review/design experience using Cadence APD.
• In-depth understanding of the flip-chip substrate design rules and the substrate fabrication processes.
• Project management and people management skills are advantages.
• Good written and verbal communication skills. Collaboration experience with OSAT and substrate suppliers is a plus.
• Good AutoCAD, MS office and computer skills
  

The Perks

With competitive compensation and great benefits, you will enjoy our workstyle within an incredible culture. We’ll give you all the tools you need to succeed so you can grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page.

Your Future

Marvell provides a work environment that promotes employee growth and development. We are searching for an individual who wants to grow with the company and will strive to improve performance. If you are driven, personable, and energetic, there will be additional opportunities for you here at Marvell.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.