Senior Package SIPI Engineer, Taiwan

仕事内容

Company

Qualcomm Semiconductor Limited

Job Area

Engineering Group, Engineering Group > Packaging Engineering

Qualcomm Overview

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

The responsibilities will include but not be limited to the following:

• Perform package extraction for the time domain and frequency domain analysis
• Perform system-level analysis for DDR, SerDes & Mixed signal interfaces
• Provide design guidelines for the Package design
• Develop design & analysis flow and automate the process
• Create technical documentation and presentations
  
  

Minimum Qualifications

• 3+ years of experience in DDR/SerDes in Package/PCB/System Design related to mobile standards
• Experience in Electromagnetics and solid background on transmission line theory & Crosstalk
• Proficiency in field solvers such as HFSS, Q3D and Sentinel-PSI
• Experience in simulation tools such as ADS and Hspice
• Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition
  
  

Preferred Qualifications

• Experience in 2.5/3D Package Structure is a plus
• Experience in design specifications of HSIO such as PCIe, USB, UFS and MIPI(CSI, DSI)
• Experience in Matlab to be able to automate existing simulation flow
• Experience in scripting language(Perl/Python) is a plus
• Master Degree with 3 ~ 4 years of experiences is preferred, Ph.D with minimal experience is considered as well
  
  

Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport

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