Package & Systems Engineer

Ampere

見る: 106

更新日: 05-11-2024

場所: Zhubei City Hsinchu County

カテゴリー: IT-ソフトウェア

業界: Semiconductor Manufacturing

レベル: Associate

ジョブタイプ: Full-time

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仕事内容

DescriptionThe RoleThe Package & Systems Engineer, Staff will be supporting both NPI and production/sustaining assembly for Ampere’s ARM processors being large OD (67x77mm) LGA modules.What You’ll Do
  • Manage day to day assembly sustaining activities with OSATs and material suppliers.
  • Generate and update/maintenance of process, QA & materials including documents, specifications, process flows and special work instructions.
  • Qualification on package level requirements expertise
  • Advanced understanding of reliability requirements, testing procedures and FA methods. Able to interpret FA report submitted by OSATs or third-party FA labs.
  • Support Si floor planning activities, package layout and architecture, thermal-mechanical stress issues.
  • Demonstrate ability of team collaboration, research & development, creative problem-solving skills.
  • Drive communications that enable the candidate to work well with internal cross functional teams, OSATs & Material Suppliers.
  • Mitigation skills to improve efficiency, output, yield, and other key performance indicators of outsourced suppliers for assembly and materials.
  • Support and collaboration with internal cross functional teams i.e., Planning, Quality, Si Design, FT and SLT, and Operations to achieve corporate goals and targets.
What You’ll Bring
  • End to end process and material knowledge for Bumping, FCBGA, PBGA, SCM, and MCM packaging
  • Knowledge of assembly outsourcing strategies with strong conviction on leading OSATs to achieve goals and expectations
  • Exposure in NPI activities for both materials and processes. Ability to safe launch programs from NPI to LVM to HVM
  • Fluent communication/presentation in both English and Mandarin, ideally to have TOEIC score above 700.
Education & Experience
  • MS Degree +3yrs related experience or BS Degree +5yrs related experience (Majoin in Mechanical, Materials Science, Physics or related)
  • MS Office Apps, MS Project, AutoCAD, Yield Analysis/Statistics
Our CompanyAmpere is designing the future of hyperscale cloud and edge computing with the world’s first cloud native processor. Built for the cloud with a modern 64-bit Arm server-based architecture, Ampere gives customers the freedom to accelerate the delivery of all cloud computing applications. With industry-leading cloud performance, power efficiency and scalability, Ampere processors are tailored for the continued growth of cloud and edge computing.Our StoryLike the scientist behind its name, Ampere employees are innovators. We understand the needs of cloud computing and different software requirements. We are inventing what comes next and looking at everything from the structure of memory and how efficient the system is, to considerations on speed, cost of electricity and ability to cool. Power, size, weight, and cost are driving the technology requirements and the innovation to come.Our world class team of engineers, with depth and expertise in the cloud and semiconductor industries, is not only focused on the development of new semiconductor designs but also building out the first software ecosystem for Arm®-based server processors. Through the Ampere approach to the cloud and edge, we give our customers the freedom to challenge the status quo and accelerate next-generation data centers for the most memory-intensive applications. Given the challenge we have outlined, we are building a culture of entrepreneurs that ensure customers come first, proactively approaching industry challenges in the areas of security, power, and performance, delivering results that matter most.We are an inclusive and equal opportunity employer. All applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability status, protected veteran status, or any other characteristic protected by law.
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締切: 20-12-2024

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