Interface Solution Engineer

仕事内容

Role Summary/Purpose

Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology.

Job Description

• Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers
• Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost
• Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc.
• Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up)
• Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage
• Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges.
• Responsible for global end to end hardware project management to ensure best quality and on time delivery
• Device testing requirement assessment and Feasibility study
• Risk analysis and mitigation planning
• Schedule planning and project management
• Design execution
• Regular review with global internal and external customers
• Quality Control and Verification
• Work closely with Teradyne Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate
• New technology research, new products, new materials evaluation for next generation device testing
• Deliver hardware design training and seminars to customers
  

Requirements

• Master’s or Bachelor’s degree in Electronic Engineering, Micro-Electronics, Mechatronics, Communication Engineering, Automation, Instrumentation and Measurement, Biomedical engineering or similar major related to circuit design or hardware engineering
• Good knowledge and understanding of electronic circuit theory and application
• Knowledge and experience in multi-layer board design and embedded system design
• Knowledge in signal integrity or power integrity theory
• Good communication skills, good written and oral English
• Meticulous ， pay attention to details
• Ability to effectively solve problems, open minded
• Ability to successfully work in a team, cross-functional environment
• Ability to travel oversea for extended period of time