High Performance Compute Packaging Engineer

仕事内容

Company

Qualcomm Semiconductor Limited

Job Area

Engineering Group, Engineering Group > ASICS Engineering

General Summary

We are looking for a highly motivated packaging engineer capable of leading state-of-the-art Flip Chip technology projects. You will be responsible for packaging development and new product introduction (NPI) of leading-edge package technologies for compute, mobile, IoT and connectivity market and driving that innovation into high volume manufacturing at assembly suppliers. Extensive knowledge and experience in package assembly process, materials, and equipment are required. The position also requires the ability to lead multi-functional teams and solve complex technical problems in working with multiple OSATs. Some international travel will be required.

Minimum Qualifications

• Minimum of 5-10 years of experience in the development and high-volume manufacturing of advanced IC packages.
• Expertise in Flip Chip CSP, FCBGA, 2.5D/3D IC packaging technologies, materials, assembly processes, equipment, and design rules.
• Understanding industry packaging trends, end-user packaging considerations, and previous experience with high performance compute and mobile consumer products.
• Excellent verbal and written communication skills.
• Exhibit organized technical project management skills (preferably, involving off-shore factories).
• Able to work independently and lead multiple programs.
• Able to lead multi-functional teams to solve complex technical problems.
• Self-driven, passionate, and creative.
  
  

Preferred Qualifications

• Hands on experience in package manufacturing, experience in technical project management, and working first-hand with semiconductor material suppliers.
• Proficiency in material and package characterization data analysis, and statistical data analysis.
• Knowledge of reliability test methods, qualification procedure, and FA techniques.
• Six Sigma Green or Black belt a plus.
  
  

Education Requirements

• Bachelor’s degree in Mechanical, Materials, Chemical Engineering or related disciplines.
• M.S. or higher degree in Engineering preferred.
  
  

Physical Requirements

• Frequently transports between offices, buildings, and campuses up to ½ mile.
• Frequently transports and installs equipment up to 5 lbs.
• Performs required tasks at various heights (e.g., standing or sitting).
• Monitors and utilizes computers and test equipment for more than 6 hours a day.
• Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.
  
  

Education

Minimum Qualifications

Certifications

Work Experiences:

Skills

Preferred Qualifications

Skills

Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport

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