External Manufacturing Engineer (TSV)

仕事内容

Description

As a key member of onsemi’s external manufacturing team, you will interact with strategic contracted semiconductor manufacturers in Asia daily.

You are ultimately expected to own the operational key performance indexes of these contracted manufacturers, lead quality, yield improvement efforts and manufacturing related projects through Change Management process.

Work with quality execution (Maverick, MRB, and Customer Complaint) within the suppliers, understanding of all capacity requirements, constraints, and processes to support demand requirements.

You will also serve internal customers as manufacturing site owner in areas of quality complain response, yield improvements, secure line capacity, OTD, and drive OEE improvement etc.

Performs other duties as required by immediate superior from time to time and provide leadership role on all Operations matters.

Requirements

• BS degree or above in Electrical Engineering, Chemistry Engineering, Material Science or related area.
• Min. 5 years of experience working with OR from fab, foundry, or advanced packaging manufacturing.
• Hands on experience with CSP bumping, TSV, and its WLP derivatives is highly preferred.
• Comprehension of HVM quality control and problem-solving methodologies. (e.g.: Is/ Is Not, 3-5 why, Fail Tree, 8D…etc.).
• Comprehension of statistical means in HVM sustain and improvement.
• Ability to work independently with good communication/interpersonal skills.
• Excellent in reading and writing English, fluency in oral English is a plus.
• Other experiences that, if have, would be a plus: Quality management, Assembly Engineering, Device Engineering, Supply Chain planning.
• Flexible in local travel (sometimes around East Asia area).