Applications Engineer: Advanced Packaging Technologies

仕事内容

This position will primarily focus on CMP method development for dielectric materials for APT and its sister organization, CMP Technologies (CMPT). This role will also provide application support for dielectric polymer chemistries targeting multiple semiconductor packaging customers through application development, supporting customer data requests and resolving customer issues. This role will be aligned within a global team, and will be supported by other applications engineers and technologists.

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