Posizione: Mid-Senior level

Tipo di lavoro: Full-time

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Contenuto del lavoro

***Please upload English resume onto our official platform: https://lnkd.in/gvkNTJG

NXP is a market leader in IOT (Internet of Things) Connectivity. From video game platforms, to mobile products, to automotive, NXP connects you to your world. Collaborate closely with the Design, Systems, Software, and Test teams to introduce new Bluetooth, WiFi, and Ultrawideband products to the market. Write software and develop hardware to test highly integrated SOCs (System on a Chip) devices on state of the art, high speed ATE (Automatic Test Equipment) from Advantest and Teradyne. Be involved in every block of the SOC including digital, analog, power management, and RF. Characterize and Qualify new silicon and drive the solution through to production ramp. Join the growing team of NXP Connectivity Test Engineering!

Responsibilities:

  • Be a part of the NPI team developing production, qualification, and characterization test programs for NXP’s Connectivity devices on ATE (Automatic Test Equipment)· Advantest 93K, Teradyne UFLEX, or other relevant ATE experience preferred
  • Digital and Mixed signal experience required, any RF experience is also good
  • Test development from design kick-off to production release
  • Debug design and process related yield and performance problems
  • Support on-site debug of complex test software and hardware issues at various external test houses

Qualifications:

  • Masters or Bachelor of Science degree in Computer or Electrical Engineering with 5+ years of experience
  • Strong communication and problem solving skills
  • Self-driven, able to take ownership and initiative
  • Strong programming background (C++, Java or Python)
  • Fluency in English is required and Mandarin is preferred
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Scadenza: 20-12-2024

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