Senior Design Engineer

☞ Xilinx

Visualizza: 214

Giorno di aggiornamento: 05-11-2024

Località: Xuejia District Tainan City

Categoria: Alta tecnologia Meccanico / Tecnico Elettrico / Elettronico IT - Software

Industria: Software Development

Tipo di lavoro: Full-time

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Contenuto del lavoro

Job Description

162039

Hsin Chu, Taiwan, Taiwan

Feb 17, 2022



Description

Job Description

Xilinx is now part of Advanced Micro Devices (AMD).

At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center.

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

The Responsibilities Of This Role Will Include But Not Limited To

The ideal candidate of this role will be in Xilinx package design and development department to oversee package definition, design, verification, and documentation.
  • Determine package architecture and design, assess package performance and cost tradeoff, collaborate with cross-functional team for package technology and design rule development and drive package structure planning to form working POR
  • Work with silicon architecture, substrate layout designer to create BGA ball map for layout feasibility & PCB routing.
  • Work with SI/PI engineer for optimizing electrical performance including substrate s-parameter PDN/SSN/X-talk/IL/RL/Inductance/EM.
  • Master of Science degree in Electrical & Electronics Engineering with 3-5+ years experience
  • Familiar with system stack, package layout, component thermal and mechanical, material, component/system level reliability, testing, and failure analysis
  • Understand in-depth package development flow and work closely with NPI program management and manufacturing/process team to synthesize a cohesive package introduction plan
  • Drive continuous improvement in package design and development cycle and ensure robust package design to meet performance, quality, cost and capacity requirements
  • Familiar with package design rules, physical layout and tools used for package design and DRC. Recommend and enable new flow and tool features for package design evolving from new package technology
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Scadenza: 20-12-2024

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