Principal Engineer, Package Engineering - Taichung

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About Marvell At Marvell, we believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. Trusted by the world’s leading technology companies for 25 years, we move, store, process and secure the world’s data with semiconductor solutions designed for our customers’ current needs and future ambitions. Through a process of deep collaboration and transparency, we’re ultimately changing the way tomorrow’s enterprise, cloud, automotive, and carrier architectures transform—for the better. The data infrastructure that our customers build has never been more critical to our global economy. It’s what’s keeping the world connected, businesses running, and information flowing. If you’re ready to excel, innovate, and truly enjoy your work, apply now for the position detailed below. The OpportunityThe package engineering team drives semiconductor package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design that results in the delivery of engineering samples and a subsequent production ramp-up. There is the excitement of always working on new projects and cutting-edge technologies. Responsibilities: Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product. Working closely with cross functional teams – BU, CE, QA and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality and reliability. Manage and mentor junior engineers Perform package design review. Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual. Provide inputs to design guidelines and drive to implement the guidelines. Achieve milestone dates for all NPI schedules. Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues. Work with procurement and suppliers on package cost analysis. Provide inputs to the package technology roadmap. Support new package and technology development. Requirements Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience. Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience. Experienced with flip-chip package development and substrate review. Basic Cadence APD and AutoCAD skills Expert understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques. The ideal candidate would be knowledgeable of 2D, 2.5D, 3D and wafer-level packaging. Good communication skills that can enable the candidate to work well with internal cross functional teams and suppliers. Good program management skills. OSAT management experience is a plus. People management experience. Ability to work independently, provide leadership and to exercise discretion to solve complex problems as the owner of key deliverables and milestone dates.