MGR SR, EXTERNAL MANUFACTURING

Contenuto del lavoro

Job Description

On Semiconductor is a Fortune 1000 Semiconductor company, among top 20 worldwide semiconductor sales leaders. Products include power and signal management, logic, discrete, and custom devices for automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications. ON Semiconductor runs a network of manufacturing facilities, sales offices and design centers in North America, Europe, and the Asia Pacific regions. Headquartered in Phoenix, Arizona.

As a key member of ON’s external manufacturing team, you will interact with strategic contracted semiconductor manufacturers in China on a daily bases. You are ultimately expected to own the operational key performance indexes of these contracted manufacturers, lead quality and yield improvement efforts. You will also serve internal customers as manufacturing site owner in areas of quality complain response, yield improvements, secure line capacity, material on-time delivery, etc.

• Individual will be responsible for managing the front end wafer foundry product yield improvement.
• Managing foundry to monitor and analysis yield related activities and driving yield improvement projects with external manufacturing site for Onsemi business needs.
• This includes ensuring foundry support for all necessary regular yield engineering and functions. Also communicate with internal supporting teams to leverage resources to support on this role.
• This requires a strong understanding of both the internal business unit requirement as well as an understanding of the overall foundry fab process capability to make the yield enhancement objective.
• Effective management will require strong capability of yield analysis skills, as strong understanding of both ATE and wafer fabrication technical.
• This require the ability to effectively engage internal and external partners at all levels of the company.
• Effectively utilizes common engineering technology and software packages for optimization of process parameters and development activities and timelines to ensure rapid implementation.

Job Qualifications

• Had MS degree or above in Electrical Engineering, Chemistry Engineering, Material Science or related area.
• Minimum 7 years of experience working with OR from fab, foundry, or advanced packaging manufacturing. 1sthand experience with CSP bumping and its derivatives is highly preferred.
• Ability to manage outsourced manufacturing, thrive for engineering excellency, OTD and quality. Demonstration of such ability from past achievements would be highly regarded.
• Comprehension of HV manufacturing quality control methodologies.
• Comprehension of Statistical means in HV manufacturing sustain and improvement.
• Efficient in reading and writing English. Fluency in oral English is a plus.
• Efficient in communication.
• Other experiences that, if have, would be a plus: Quality management, Process Engineering, Device Engineering, Supply Chain planning.
• Flexible in local travel (frequent around Taiwan area, occasionally around Asia);
  

Primary Location

TW-TW-Zhubei

Work Locations

TWZC02 ON SEMICONDUCTOR TECHNOLOGY ZHUBEI OFFICE

Job

Manufacturing

Travel

Yes, 15 % of the Time

Job Posting

Aug 30, 2021, 5:13:23 PM